EnviroMetal Technologies Inc. Announces New Technology License For Remediation Of Trace Metal Contaminants In Europe And The United Kingdom
Technology Removes Radionuclides and Hazardous Trace Metals, Such as Chromium, Arsenic and Lead, from Groundwater Resources
Waterloo, ON - EnviroMetal Technologies Inc. (ETI) is pleased to announce it has reached a license agreement with the University of Waterloo to commercialize the University's in situ reactive treatment technology for removal of hazardous inorganic contaminants in groundwater for applications in Europe and the United Kingdom. This technology, which compliments ETI's existing permeable reactive barrier technology for organic contaminants, can effectively remove hazardous trace metals (chromium, arsenic and lead), and radionuclides, from groundwater resources.
"We intend to offer this ground-breaking technology through our existing licensing network in Europe and the United Kingdom," said John Vogan, president of ETI. "There are already several potential applications which we know of at existing industrial facilities and brownfield redevelopment sites, where this technology may be applied in the next twelve to eighteen months."
"The University, with support from the technology's inventors Dr. David Blowes and Dr. Carol Ptacek, has been quite successful in establishing its use in the Canadian and United States markets," added Scott Inwood, of University of Waterloo's Intellectual Property Management Office. "We want to take advantage of our long- standing relationship with ETI to more effectively deliver this technology to the end-user community overseas."
This patent-protected technology involves the placement of specifically tailored reactive materials in situ to remediate hazardous groundwater contaminants. Because it represents a long-term passive treatment solution, the technology is more cost-effective than other alternatives. Trace metal removal systems have been implemented by the University at over 20 sites in the USA and Canada.
SOURCE: EnviroMetal Technologies Inc.